Assembly structure and electronic device having the same

ABSTRACT

The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.15/164,214, filed on May 25, 2016, which is based upon and claimspriority to Chinese Patent Application No. 201510362342.2, filed Jun.26, 2015, the entire contents of which are incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to an assembly structure and anelectronic device, and more particularly, to an assembly structure forproviding power for a chip and an electronic device having the assemblystructure.

BACKGROUND

With growth of demand for intelligent life of people, demand for dataprocessing is also growing. Throughout the world, power consumptionspent on data processing has reached hundreds of billions of or eventrillions of kilowatts-hours each year on average, and a large datacenter may occupy an area up to tens of thousands of square meters.Accordingly, high efficiency and high power density are key pointers ofhealthy development of a data center.

Key units of a data center are servers, each of which is typicallyequipped with a main board composed of data processing chips (such as aCPU, chipsets, a memory or the like), their power supply modules andnecessary peripheral components. With increase of processing capacityper volume unit of a server, the amount and integration level of theprocessing chips are also increasing, resulting in increase of spaceoccupancy and power consumption. Accordingly, the power supply module(also referred to as a main board power supply module since it isprovided on the same main board with the data processing chips) for thechips is expected to have higher efficiency, higher power density andsmaller volume than before, to realize energy saving and reduction ofarea occupancy for the entire server or even for the entire data center.Along with increase of computing speeds of chips, power consumption ofthe chips increases. Although supply voltages of the chips trend to bereduced, supply currents are still increased greatly due to increase ofamount of transistors, which causes that losses on a current path fromthe power source modules to the chips increase greatly and wholeefficiency of systems are reduced.

FIG. 1A is a schematic diagram of a chip installing mode and a powersupply mode in prior art. A main board 11 of a server is provided with aprocessor chip 12 (for example, a central processing unit (CPU), agraphics processor unit (GPU), and a data communication switch chip orother large scale integrated circuit chips and the like, here theprocessor chip in FIG. 1A takes the CPU as an example) and a powersupply module 13 (for example, a DC (direct current)/DC module). Inaddition, the processor chip 12 is provided thereon with a heat sink 14for dissipating heat it produces. Since the processor chip 12 is usuallya very sophisticated device, which has a plurality of pins, even up to2000 or more, to ensure reliable connections between all pins and thesystem, an additional member (for example, a socket 15, a CPU clip 16, asupport plate 17, a back plate 18 and a screw 19 and the like in FIG.1A) is usually needed to fix the processor chip 12 to the main board 11.In addition, a capacitor 111 is further provided between the processorchip 12 and the power supply module 13 on the main board 11. Suchstructural members occupy much space around the chip 12, so that thepower supply module 13 cannot be close to the processor chip 12, whichresults in a long current path and more losses. In some applications,the losses may even reach 2% of total power consumption of the chip.

FIG. 1B is another schematic diagram of a chip installing mode and apower supply mode in the prior art. Body heights of some processor chips12 with high energy consumption are very low and relatively large heatsinks 14 are provided. Heights of the power supply modules are hard tobe lower than the body heights of the chips. Limited by sizes of theheat sinks, the power supply modules cannot be placed in positions closeto the chips, which results in long current paths and more losses.

SUMMARY OF THE DISCLOSURE

One aspect of the present disclosure provides an assembly structure,including:

a circuit board, configured to provide a first electrical energy;

a chip;

a power converting module, configured to electrically connect thecircuit board and the chip, convert the first electrical energy to asecond electrical energy, and supply the second electrical energy to thechip, wherein the chip, the circuit board and the power convertingmodule are stacked; and

a connection component, configured to electrically connect the circuitboard and the power converting module.

The present disclosure assembles a power converting module with acircuit board and a chip in a stacking manner, which may shorten acurrent path between the power converting module and the chip.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are schematic diagrams of an assembly structure forproviding power for a chip in the prior art:

FIG. 2 is a schematic diagram of an assembly structure for providingpower for a chip in which a power converting module and a chip arelocated in the same side of a circuit board, according to an embodimentof the present disclosure:

FIG. 2A is a schematic diagram of an assembly structure for providingpower for a chip in which a power converting module is partly buried ina socket and directly contacts a circuit board, according to anembodiment of the present disclosure:

FIGS. 2B-2C are schematic diagrams of an assembly structure forproviding power for the chip of FIG. 2A in which the power convertingmodule and the circuit board are connected through pins;

FIGS. 2D-2E are schematic diagrams of an assembly structure forproviding power for a chip in which a power converting module is partlyburied in a socket and directly contacts a chip, according to anembodiment of the present disclosure;

FIGS. 2F-2G are schematic diagrams of an assembly structure forproviding power for a chip in which a power converting module isentirely buried in a socket, according to a further embodiment of thepresent disclosure;

FIGS. 3A-3C are schematic diagrams of a distribution of pins between apower converting module and a chip in an assembly structure, accordingto an embodiment of the present disclosure;

FIGS. 4A-4B are schematic diagrams of heat dissipation of the assemblystructure for providing power for the chip of embodiments as shown inFIGS. 2A-2E:

FIG. 5 is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure whichincludes an electromagenetic shielding layer;

FIG. 6 is a schematic diagram of an assembly structure for providingpower for a chip in which a power converting module and a chip arelocated in different sides of a circuit board, according to anembodiment of the present disclosure;

FIG. 6A is a schematic diagram of an assembly structure for providingpower for a chip in which a power converting module is partly buried ina back plate and directly contacts a circuit board, according to anembodiment of the present disclosure;

FIGS. 6B-6C are schematic diagrams of an assembly structure forproviding power for a chip of FIG. 6A in which a power converting moduleand a circuit board are connected through a pin;

FIGS. 6D-6G are schematic diagrams of an assembly structure forproviding power for a chip in which a power converting module is partlyburied in a back plate and contacts a circuit board through a connector,according to an embodiment of the present disclosure;

FIGS. 6H-6I are schematic diagrams of an assembly structure forproviding power for a chip in which a power converting module isentirely buried in a back plate, according to a further embodiment ofthe present disclosure;

FIGS. 7A-7C are schematic diagrams of a distribution of pins between apower converting module and a circuit board in an assembly structure,according to an embodiment of the present disclosure;

FIGS. 8A-8E are schematic diagrams of heat dissipation of an assemblystructure for providing power for a chip of an embodiment of the presentdisclosure;

FIG. 9 is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure whichincludes an electromagenetic shielding layer:

FIG. 10 is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure in which apower converting module penetrates through a circuit board;

FIG. 10A is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure in which apower converting module penetrates through a circuit board and is partlyburied in a socket;

FIG. 10B is a schematic diagram of an assembly structure for providingpower for a chip in which a power converting module and a circuit boardare separately provided;

FIG. 10C is a schematic diagram of an assembly structure for providingpower for a chip in which a power converting module and a circuit boardare integrated into an entirety;

FIG. 11 is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure in which apower converting module includes two power converting modules:

FIG. 11A is a schematic diagram of an assembly structure for providingpower for a chip of another embodiment of the present disclosure inwhich a power converting module includes a control module and aconverting module separately provided;

FIG. 11B is a schematic diagram of an assembly structure for providingpower for a chip of another embodiment of the present disclosure whichincludes two power converting modules; and

FIGS. 12A-12G are schematic diagrams of functions and mutual connectionrelationships between power converting modules.

DETAILED DESCRIPTION

FIG. 2 is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure. Theassembly structure 2 for providing power for a chip includes a circuitboard 21, which provides a first electrical energy; a chip 22, which maybe a CPU, a GPU or a memory and the like; and a power converting module23, which is electrically connected to the circuit board 21 and the chip22, converts the first electrical energy to a second electrical energy,and supplies the second electrical energy to the chip 22. Wherein thepower converting module 23 may be located between the chip 22 and thecircuit board 21 and they are mutually stacked to form the assemblystructure 2. However, the present disclosure is not limited to this. Anupper surface of the power converting module 23 and a lower surface ofthe chip 22 may be contacted and electrically connected. A lower surfaceof the power converting module 23 and an upper surface of the circuitboard 21 may be contacted and electrically connected. A connecting modebetween the power converting module 23 and the chip 22 may be welding orpressing, etc. In the present embodiment, the power converting module 23is disposed below the chip 22 and the power converting module 23directly contacts and electrically connects the chip 22, which shortensthe current path between the power source conversion module 23 and thechip 22, reduces current transmission losses, lowers area occupancy ofcomponents on the circuit board 21, and saves space of the whole system.

FIG. 2A is a schematic diagram of an assembly structure for providingpower for a chip of another embodiment of the present disclosure. Maindifferences between the assembly structure 2 for providing power for achip in the present embodiment and that of the above embodiment lie inthat, it further includes a socket 25. The chip 22 is electricallyconnected to the socket 25, the power converting module 23 may be partlyburied in the socket 25, a lower surface of the power converting module23 may be exposed from the socket 25, and the lower surface of the powerconverting module 23 may contact an upper surface of the circuit board21. The power converting module 23 may be electrically connected to thesocket 25. In one embodiment, the power converting module 23 may providethe second electrical energy for the chip 22 at least partly through thesocket 25. The power converting module 23 and the socket 25 may be twoseparate components to be assembled together, or may be integrated intoan undetachable component through molding technology or embeddingtechnology used in packaging. The present disclosure is not limited tothis.

The power converting module 23 includes an input and an output. Theinput of the power converting module 23 may include power input or asignal input of the power converting module 23, or include both. Asshown in FIG. 2B, input pins 231 provided on the lower surface of thepower converting module 23 electrically connect the circuit board 21.The power input and/or signal input may be directly transmitted to thepower converting module 23 from the circuit board 21, as shown by arrowsin FIG. 2B. As shown in FIG. 2C, output pins 232 provided on the lowersurface of the power converting module 23 electrically connect thecircuit board 21, and they may further connect the chip 22 through thecircuit board 21 and the socket 25. A power output and/or signal outputmay be transmitted from the power converting module 23 to the chip 22through the circuit board 21 and the socket 25 in sequence. However, thepresent disclosure is not limited to this. For example, the power outputand/or signal output may be transmitted from the power converting module23 to the chip 22 through the socket 25, or may be directly transmittedto the chip 22, and so on. A connecting mode between the pins 231 and232 and the circuit board 21 may be welding or pressing, etc. Thepresent disclosure is not limited to this.

FIG. 2D is a schematic diagram of an assembly structure for providingpower for a chip of another embodiment of the present disclosure. Itmainly differs from the embodiments as shown in FIGS. 2A-2C in that, thepower converting module 23 is partly buried in the socket 25, an uppersurface of the power converting module 23 is exposed from the socket 25,and the upper surface of the power converting module 23 contacts a lowersurface of the chip 22. The power converting module 23 may directlyprovide the second electrical energy for the chip 22. Because the uppersurface of the power converting module 23 may directly contact the lowersurface of the chip 22, an input and an output of the power convertingmodule 23 may be directly connected with the chip 22. Combining withFIG. 2E, power and/or signals may be transmitted between the chip 22 andthe power converting module 23, wherein a transmission direction of thepower and/or signals may be as shown by the arrows in FIG. 2E. Setpositions of the pins electrically connecting the power convertingmodule 23 and the chip 22, connecting mode between the pins and thechip, and structure of the pins may be the same as illustrated in theembodiments as shown in FIGS. 2A-2C, which will not be repeated here,but the present disclosure is not limited to this.

FIG. 2F is a schematic diagram of an assembly structure for providingpower for a chip of a further embodiment of the present disclosure. Itmainly differs from the embodiments as shown in FIGS. 2A-2E where thepower converting module 23 is partly buried in the socket 25 in that, inthe present embodiment, the power converting module 23 is entirelyburied in the socket 25. The power converting module 23 is electricallyconnected to the socket 25. The power converting module 23 provides thesecond electrical energy for the chip 22 through the socket 25. An inputof the power converting module 23 may connect the circuit board 22through the socket 25. Input power and/or signals are transmitted fromthe circuit board 21 to the socket 25, and then transmitted to the powerconverting module 23 through the socket 25. Connections of the inputpower and/or signals between the power converting module 23 and thesocket 25 may be on a side surface, an upper surface or a lower surfaceof the power converting module 23, or may be on a plurality of surfaces,which is shown by the arrows in FIG. 2F. However, the present disclosureis not limited to this. As shown in FIG. 2G an output of the powerconverting module 23 may connect the chip 22 through the socket 25.Output power and/or signals are transmitted from the power convertingmodule 23 to the socket 25, and then transmitted to the chip 22 throughthe socket 25. Connections of the power output and/or signal outputbetween the power converting module 23 and the socket 25 may be on aside surface, an upper surface or a lower surface of the powerconverting module 23, or may be on a plurality of surfaces, which isshown by the arrows in FIG. 2G. However, the present disclosure is notlimited to this. The power converting module 23 and the socket 25 may beintegrated into an undetachable entirety, or the power converting module23 and the socket 25 may be detachable components. When the powerconverting module 23 and the socket 25 are integrated into an entirety,the connections between the power converting module 23 and the socket 25may be realized via conductors inside. While when the power convertingmodule 23 and the socket 25 are detachable components, a connecting modebetween the power converting module 23 and the socket 25 may adopt wayssuch as welding or pressing.

An arrangement of output pins of the power converting module 23 may bedetermined according to corresponding pin positions of the chip 22, thesocket 25 or the circuit board 21, to realize a shorter power and/orsignal transmitting distance. FIGS. 3A and 3B are schematic diagrams ofpin arrangements when the power converting module 23 directly connectsthe chip 22, wherein FIG. 3A is a side view and FIG. 3B is a plan view.Power input pins 231 (or electrical energy input terminals) of the chip22 are denoted by dashed circles, which may be distributed in differentregions of surfaces of the chip 22. Power received by respective regionsmay be different, which is denoted by current values in FIG. 3B. Poweroutput pins 232 (denoted by dashed boxes in FIG. 3B) of the powerconverting module 23 may be arranged according to positions of the powerinput pins of the chips, distributed on surfaces of the power convertingmodule 23. For example, projections of the power output pins 232 of thepower converting module 23 and projections of the power input pins ofthe chip 22 in a direction perpendicular to the circuit board, may beoverlapped. The present disclosure is not limited to this. The chip 22and the power converting module 23 may use pins with different shapes,sizes, and/or materials according to power demand of regions where thepins are located, to realize the aim of reducing power transmissionlosses. Respective regions of surfaces of the power converting module 23may have one or more pins. A surface for electrical connection may bereferred to as an electrical connecting surface. For example, the uppersurface of the power converting module 23 may be referred to as a firstelectrical connecting surface, the lower surface of the chip 22 may bereferred to as a second electrical connecting surface. However, thepresent disclosure is not limited to this. In one embodiment, the chiphas at least one electrical energy input terminal, which may be providedon the lower surface or other positions of the chip. The power outputterminals of the power converting module 23 may be provided on the uppersurface or other positions of the power converting module 23. Projectionof the electrical energy input terminal of the chip and projection ofthe power output terminal of the power converting module in a directionperpendicular to the circuit board, may be overlapped, to further reducecurrent path length. However, the present disclosure is not limited tothis.

Combining with FIGS. 4A and 4B, input pins 231 and output pins 232 ofthe power converting module 23 may be located on the same surface (forexample, a top surface or a bottom surface) or different surfaces of thepower converting module 23. Alternatively, the input pins 231 and outputpins 232 of the power converting module 23 may be partly located on thesame surface or partly located on different surfaces of the powerconverting module 23. The present disclosure is not limited to this. Theinput pins 231 and output pins 232 of the power converting module 23 mayadopt the same connecting mode or different connecting modes to connectthe circuit board 21 and the chip 22. For example, in FIG. 3C, a part ofpower input pins 2311 (for example, input positive Vin+, input negativeVin−, auxiliary power supply and the like), a part of signal input pins2312 (for example, input voltage sampling, input current sampling andthe like), and a part of signal output pins 2322 (for example, anovercurrent warning signal, a module overheat warning signal and thelike) of the power converting module 23 may be located on the bottomsurface of the power converting module 23 and connected with the circuitboard 21. A part of power output pins 2321 (for example, output positiveVo+, output negative Vo− and the like), a part of signal output pins2322 (for example, an input current monitoring signal, an output currentmonitoring signal and the like), and a part of signal input pins 2312(for example, a terminal voltage sampling signal of the chip and thelike) may be located on the top surface of the power converting module23 and connected with the chip 22. A part of power input pins 2311 (forexample, the input positive Vin+, the input negative Vin−, the auxiliarypower supply and the like), a part of power output pins 2321 (forexample, the output positive Vo+, the output negative Vo− and the like),a part of signal input pins 2312 (for example, a digital communicationinput and the like) and a part of signal output pins 2322 (for example,a digital communication output and the like) may be alternativelylocated on a side surface of the power converting module 23 andconnected with the socket 25.

In the above embodiments, the chip 22 is equipped with a heat sink 24,but the present disclosure is not limited to this. For example, the heatsink may not only contact the chip, but also directly contact the powerconverting module 23, to dissipate heat from the power converting module23. FIGS. 4A and 4B are schematic diagrams of heat dissipation of theassembly structure for providing power for a chip of the aboveembodiments. As shown in FIG. 4A, the heat may be conducted from thepower converting module 23 to the chip 22 through a connection betweenthe power converting module 23 and the chip 22, or it may be laterallyconducted through the socket 25 and then conducted upwards. In order toconduct the heat of the power converting module 23 to surroundingelements more smoothly, heat conductive material may be filled in gapsbetween the power converting module 23 and the surrounding elements orgaps between respective adjacent parts. As shown in FIG. 4A, heatconductive material 3 is directly filled between the power convertingmodule 23 and the chip 22, and between the socket 25 and the chip 22.The heat may be conducted from the power converting module 23 or thesocket 25 to the chip 22 through the heat conductive material 3, andthen conducted to the heat sink 24 through the chip 22. As long as heatconductivity coefficient of the filled material is better than that ofthe air, it may facilitate heat conducting from the power convertingmodule 23 to the surrounding elements.

Heat of the power converting module 23 may be dissipated by beinglaterally conducted to other regions through the circuit board 21. Forexample, the heat may be conducted to the support plate 27 through thecircuit board 21 and then dissipated by the support plate 27. As shownin FIG. 4B, heat of the power converting module 23 may be conducted to alower surface of the circuit board 21 in a vertical direction through athermal via 4, and then dissipated by the heat sink or a back plate 28provided below. In order to conduct the heat of the power convertingmodule 23 to the circuit board 21 and the surrounding elements moresmoothly, heat conductive material may be filled in gaps between thepower converting module 23 and the circuit board 21, gaps between thecircuit plate 21 and the surrounding elements or gaps between respectiveadjacent elements. Heat dissipation of the power converting module 23may be realized by a combined mode as shown in FIGS. 4A and 4B or othermodes. The present disclosure is not limited to this.

FIG. 5 is a schematic diagram of an assembly structure for providingpower for a chip of an embodiment of the present disclosure whichincludes an electromagnetic shielding layer 5. Electromagnetic fieldsgenerated by power conversion exist around the power converting module23. If handled improperly, the electromagnetic fields will couple to thechip 22 nearby and/or peripheral circuits of the chip 22, resulting inwrong operations of the chip 22. This phenomenon is calledelectromagnetic interference (EMI). In order to prevent EMI, theelectromagnetic shielding layer 5 may be installed around the powerconverting module 23. If needed, the electromagnetic shielding layer 5may be provided on one surface or a plurality of surfaces of the powerconverting module 23, wherein the electromagnetic shielding layer on anysurface may cover the surface entirely (overall shielding) or cover thesurface partially (shadow shielding). At least a part of theelectromagnetic shielding layer 5 may be located between the chip 22 andthe power converting module 23, and vertically stacked with the powerconverting module 23 and the chip 22, to reduce or even eliminate mutualinterference between the chip 22 and the power converting module 23.Aiming at shielding of different purposes, such as electric shielding ormagnetic shielding, material of the shielding layer 5 may be metalmaterial (such as copper, aluminum and the like) or magnetic material(such as soft magnetic material) correspondingly. The shielding layer 5may be installed as a separate component, or may be integrated togetherwith the power converting module 23 and/or the socket 25, or may bepartly separated and partly integrated with other components.

Stacking modes in the assembly structure for providing power for a chipof the above embodiments are that, the power converting module 23 andthe chip 22 are located on the same side of the circuit board 21. FIG. 6is another stacking mode of the assembly structure for providing powerfor a chip according to an embodiment of the present disclosure. A powerconverting module 63 and a chip 62 are respectively located on twoopposite sides of a circuit board 61. The power converting module 63 mayelectrically connect the chip 62 through the circuit board 61. A heatsink (not shown) may be provided to directly contact the powerconverting module 63.

FIG. 6A is a schematic diagram of an assembly structure for providingpower for a chip according to another embodiment of the presentdisclosure. Compared with FIG. 6, the assembly structure for providingpower for a chip further includes a socket 65 and a back plate 68. Thesocket 65 is located between the chip 62 and the circuit board 61, andelectrically connects the chip 62 and the circuit board 61. The powerconverting module 63 may be partly buried in the back plate 68. An uppersurface of the power converting module 63 may be exposed from the backplate 68, and the upper surface of the power converting module 63 maycontact a lower surface of the circuit board 61. The power convertingmodule 63 and the back plate 68 may be two components to be usedseparately or by being combined, or they may be integrated into anundetachable component, for example through molding technology orembedding technology used in packaging to bury the power convertingmodule 63 in the back plate 68. The present disclosure is not limited tothis.

The power converting module 63 includes an input and an output. Theinput of the power converting module 63 may be a power input or a signalinput of the power converting module 63, or including both. As shown inFIG. 6B, input pins 631 provided on the upper surface of the powerconverting module 63 electrically connect the circuit board 61. Thepower input and/or signal input may be directly transmitted to the powerconverting module 63 from the circuit board 61, as shown by arrows inFIG. 6B. As shown in FIG. 6C, output pins 632 provided on the uppersurface of the power converting module 63 electrically connect thecircuit board 61, and they may further connect the chip 62 through thecircuit board 61 and the socket 65. A power output and/or signal outputmay be transmitted from the power converting module 63 to the chip 62through the circuit board 61 and the socket 65 in sequence. However, thepresent disclosure is not limited to this. For example, in someembodiments, the socket may be omitted. Combining with FIG. 6C, aconnecting mode between the pins 631 and 632 and the circuit board 61may be welding or pressing.

FIG. 6D is a schematic diagram of an assembly structure for providingpower for a chip of another embodiment of the present disclosure. Itmainly differs from the embodiments as shown in FIGS. 6A-6C in that, thepower converting module 63 is partly buried in the back plate 68, alower surface of the power converting module 63 is exposed from the backplate 68, and the lower surface of the power converting module 63directly contacts a connector 7. The connector 7 is located below theback plate 68, and may stride over the back plate 68 to connect thecircuit board 61 with the power converting module 63. However, thepresent disclosure is not limited to this, as long as the powerconverting module 63 may be electrically connected with the circuitboard 61 or the chip 62. Wherein the input pins 631 provided on thelower surface of the power converting module 63 may be connected withthe connector 7, and electrically connected with the circuit board 61through the connector 7. The power input and/or signal input may betransmitted from the circuit board 61 to the power converting module 63through the connector 7, as shown by arrows in FIG. 6D. As shown in FIG.6E, the connector 7 may be partly located between the back plate 68 andthe circuit board 61. The power input and/or signal input in thisstructure may be shown by arrows in FIG. 6E. The present disclosure isnot limited to this, and a structure and a style of the connector 7 maybe various. A connecting mode between the power converting module 63 andthe connector 7 may be welding or pressing, etc. A connecting modebetween the circuit board 61 and the connector 7 may be welding orpressing, etc. As shown in FIG. 6E, a connection between the connector 7and the circuit board 61 may be by welding. The back plate 68 may beused to press the connector 7 on the circuit board 61 and make pins (notshown in FIG. 6E) between them connected. A position at which theconnector 7 connects the circuit board 61 may be located on one side ora plurality of sides of the power converting module 63. The power outputand/or signal output between the power converting module 63 and thecircuit board 61 may be transmitted from the power converting module 63through the pins 632 to the circuit board 61 via the connector 7, asshown by arrows in FIGS. 6F-6G. In one embodiment, the connector 7 maypartly penetrate through the back plate 68, but the present disclosureis not limited to this. In one embodiment, the connector 7 may bedesigned as a configuration or structure assisting heat dissipation. Forexample, the connector 7 itself may be made of heat conductive material.Furthermore, a heat sink (not shown) may be provided to contact theconnector 7 for heat dissipation. The above mentioned back plate and/orconnector can be called as a connection component.

FIG. 6H is a schematic diagram of an assembly structure for providingpower for a chip of a further embodiment of the present disclosure. Itmainly differs from the embodiments as shown in FIGS. 6A-6E where thepower converting module 63 is partly buried in the back plate 68 inthat, in the present embodiment, the power converting module 63 isentirely buried in the back plate 68. An Input of the power convertingmodule 63 may connect the circuit board 61 through the back plate 68.Power and/or signals are transmitted from the circuit board 61 to theback plate 68, and then transmitted to the power converting module 63through the back plate 68. Connections of the power input and/or signalinput between the power converting module 63 and the back plate may beon a side surface, an upper surface or a lower surface of the powerconverting module 63, or may be on a plurality of surfaces, which isshown by the arrows in FIG. 6H. As shown in FIG. 6I, an output of thepower converting module 63 may connect the chip 62 through the backplate 68. Power and/or signals are transmitted from the power convertingmodule 63 to the back plate 68, and then transmitted to the circuitboard 61, the socket 65 and the chip 22 through the back plate 68 insequence. However, the present disclosure is not limited to this. Insome embodiments, the socket may be omitted. Connections of the poweroutput and/or signal output between the power converting module 63 andthe back plate 68 may be on a side surface, an upper surface or a lowersurface of the power converting module 63, or may be on a plurality ofsurfaces, which is shown by the arrows in FIG. 6I. The power convertingmodule 63 and the back plate 68 may be integrated into an undetachableentirety, and at this time, the connections between the power convertingmodule 63 and the back plate 68 may be realized via conductors inside.The power converting module 63 and the back plate 68 may be detachablecomponents. A connecting mode between the power converting module 63 andthe back plate 68 may be welding or pressing, etc.

An arrangement of the output pins 632 of the power converting module 63may be determined according to corresponding pin positions of the chip62, the socket 65 or the circuit board 61. For example, projections ofthe output pins 632 of the power converting module 63 and projections ofthe electrical energy input terminal of the chip in a directionperpendicular to the circuit board, are overlapped, to realize a shorterpower and/or signal transmitting distance. FIGS. 7A and 7B are schematicdiagrams of pin arrangements when the power converting module 63directly connects the circuit board 61, wherein FIG. 7A is a side viewand FIG. 7B is a plan view. The power input pins 631 of the socket 65are denoted by dashed circles, which may be distributed in differentregions of surfaces of the socket 65. Power received by respectiveregions may be different, which is denoted by current values in FIG. 7B.The power output pins 632 (denoted by dashed boxes in FIG. 7B) of thepower converting module 63 may be arranged according to positions of thepower input pins 631 of the socket, distributed on surfaces of the powerconverting module 63. Pins with different shapes, sizes, and/ormaterials may be used according to power demand of the regions they arelocated, to achieve an aim of reducing power transmission losses. Therespective regions of surfaces of the power converting module 63 mayhave one or more pins. In the present embodiment, projections of theelectrical energy input terminal of the chip and of the power outputpins of the power converting module in a direction perpendicular to thecircuit board, are overlapped, to further reduce current path length.However, the present disclosure is not limited to this.

The input pins 631 and output pins 632 of the power converting module 63may be located on the same surface (for example, a top surface or abottom surface) or different surfaces of the power converting module 63.Alternatively, the input pins 631 and output pins 632 of the powerconverting module 63 may be partly located on the same surface andpartly located on different surfaces of the power converting module 63.The input pins 631 and output pins 632 of the power converting module 63may adopt the same connecting mode or different connecting modes toconnect the circuit board 61 and the chip 62. For example, in FIG. 7C, apart of power input pins 6311 (for example, the input positive Vin+, theinput negative Vin−, the auxiliary power supply and the like), a part ofsignal input pins 6312 (for example, the input voltage sampling, theinput current sampling and the like), and a part of signal output pins6322 (for example, the overcurrent warning signal, the module overheatwarning signal and the like) of the power converting module 63 may belocated on the bottom surface of the power converting module 63 andconnected with the circuit board 61 through the connector 7. A part ofpower output pins 6321 (for example, the output positive Vo+, the outputnegative Vo− and the like), a part of signal output pins 6322 (forexample, the input current monitoring signal, the output currentmonitoring signal and the like), and a part of signal input pins 6312(for example, the terminal voltage sampling signal of the chip and thelike) may be located on the top surface of the power converting module63 and connected with the chip 62 through the circuit board 61 and thesocket 65 in sequence. A part of power input pins 6311 (for example, theinput positive Vin+, the input negative Vin−, the auxiliary power supplyand the like), a part of power output pins 6321 (for example, the outputpositive Vo+, the output negative Vo− and the like), a part of signalinput pins 6312 (for example, the digital communication input and thelike) and a part of signal output pins 6322 (for example, the digitalcommunication output and the like) may be located on the side surface ofthe power converting module 63 and connected with the back plate 68.

FIGS. 8A-8E are schematic diagrams of heat dissipation of the assemblystructure for providing power for a chip of the above embodiments asshown in FIGS. 6A-6F. As shown in FIG. 8A, In order to conduct the heatof the power converting module 63 to the circuit board 61 and the backplate 68 more smoothly, heat conductive material 3 may be filled in gapsbetween the power converting module 63 and the circuit board 61, gapsbetween the power converting module 63 and the back plate 68, and gapsbetween the circuit board 61 and the back plate 68. As shown in FIG. 8B,heat of the power converting module 63 may be dissipated through achassis 8 of the system. Heat conductive material 3 (for example,thermal conductive silicone or thermal pad and the like) may be filledin gaps between the power converting module 63 and the chassis 8, gapsbetween the power converting module 63 and the back plate 68, and gapsbetween the chassis 8 and the back plate 68. As shown in FIG. 8C, heatof the power converting module 63 may be dissipated through theconnector 7, or may be dissipated through a heat sink 64′ (a second heatsink) provided below the power converting module 63. The heat sink 64′may contact the connector, or may directly contact the power convertingmodule 63. The present disclosure is not limited to this. The connector7 and the heat sink 64′ provided below the power converting module 63may be separate components, or may be one component or may be molded asa whole, such as a structure as shown in FIG. 8E. For example, byapplying a process such as stamping, milling and so on, on the connector7, a wing shaped structure as shown in FIG. 8C is formed on a surface ofthe connector 7. The similar process may be adopted to deal with astructure of the heat sink 64′ as shown in FIG. 8D. The presentdisclosure is not limited to this. The difference between FIGS. 8D and8C mainly lies in that the back plate 68 is omitted in FIG. 8D.

In order to prevent EMI, the electromagnetic shielding layer 5 may beinstalled around the power converting module 6, as shown in FIG. 9. Ifneeded, the electromagnetic shielding layer 5 may be provided on onesurface or a plurality of surfaces of the power converting module 63,wherein the electromagnetic shielding layer on any surface may cover thesurface entirely (overall shielding) or cover the surface partially(shadow shielding). At least a part of the electromagnetic shieldinglayer may be located between the chip 62 and the power converting module63, and vertically stacked with the power converting module 63 and thechip 62, to reduce or even eliminate mutual interference between thechip 62 and the power converting module 63. Material of the shieldinglayer may be metal material (such as copper, aluminum and the like) ormagnetic material (such as soft magnetic material) correspondingly. Theshielding layer may be installed as a separate component, or may beintegrated together with the power converting module 63 and/or the backplate 68, or may be partly separated and partly integrated with othercomponents. If the back plate 68 is entirely or locally made of metalmaterial, the whole or a part of the metal material of the back plate 68may be used to realize a function of electromagnetic shielding.

FIG. 10 is a schematic diagram of stacking of an assembly structure 10for providing power for a chip according to another embodiment of thepresent disclosure. The power converting module 103 (DC/DC) and the chip102 is stacked in a vertical direction. The power converting module 103penetrates through an opening in a circuit board 101 and electricallyconnects the chip 102.

FIG. 10 A is a schematic diagram of stacking of an assembly structurefor providing power for a chip according to another embodiment of thepresent disclosure. It mainly differs from the assembly structure forproviding power for a chip as shown in FIG. 10 in that, it furtherincludes a socket 105, and the power converting module 103 may be partlyburied in the socket 105. As shown in FIG. 10B, when thickness of thepower converting module 103 is less than or equal to that of the circuitboard 101, the power converting module 103 may only penetrate throughthe circuit board 101 and may be not buried in the socket 105. The powerconverting module 103 and the circuit board 101 in FIGS. 10 and 10A maybe separate elements and may be assembled together later. As shown inFIG. 10C, molding technology or embedded technology used in packagingmay be adopted to integrate the power converting module 103 and thecircuit board 101 into an undetachable component. In one embodiment, thepower converting module 103 may be partly buried in the circuit board11.

As shown in FIG. 11, the amount of the power converting module may bemore than one, for example, two. These power converting modules may belocated on the same side or different sides of the circuit board, orpartly buried in the circuit board. The present disclosure is notlimited to this.

The above embodiments describe the modes that the power convertingmodules 23, 63 and 103, the chips 22, 62 and 102 and the circuit boards21, 61 and 101 are vertically stacked. Here, the power convertingmodules 23, 63 and 103 may contain power converting modules (or referredto as main circuit modules). Topological structures of a convertingcircuit of the power converting modules may have many choices, forexample, a PWM (Pulse Width Modulation) type circuit (such as Buck,flyback, forward and the like). It may be a resonant type circuit (suchas LLC (Inductor, Inductor and Capacitor) and the like) and so on. Acontrol circuit that controls the converting circuit may be integratedinto the power converting modules 23, 63 and 103, or it may be separatedout to form a separate control module. As shown in FIG. 11A, the controlmodule 69 (or referred to as a control circuit module) may be verticallystacked with the power converting module 69′, the chip 62 and thecircuit board 61. The positions of the power converting module 69′ andthe control module 69 may be interchanged. The control module 69 and thepower converting module 69′ may be on the same side of the circuitboard, or may be partly buried in the circuit board. The presentdisclosure is not limited to this. The control module 69 may not bestacked with the power converting module 69′ and the chip 62 and thelike, and may be disposed on one side of the circuit board 61. Here, theposition arrangements of the respective power converting modules 23, 63and 103 described in the above embodiments are all applicable to thepower converting module 69′ and/or the control module 69. The powerconverting module 69′, the control module 69 and the chip 62 (forexample, a CPU) may transmit signals through wireless communication or awired way, etc. For example, connection and communication may beperformed via signal lines (not shown in FIG. 11A) on the circuit board61 or the socket 65. The power converting modules 23, 63 and 103 may bea DC/DC module, but the present disclosure is not limited to this.

As shown in FIG. 11B, a first module (module 1) and a second module(module 2) may be the power converting module 69′, or may be the powerconverting modules 23, 63 and 103. The first module and the secondmodule (module 2) may be input-series, or in parallel, or cascading or acombination of these connecting modes. The present disclosure is notlimited to this. For example, input-series-output-parallel orinput-parallel-output-parallel may be adopted. The amount of the powerconverting modules and/or the power converting modules may be more thanone. A plurality of modules may supply power for the chips, or otherloads, or for the chips and other loads at the same time. A part or allof the plurality of modules may locate on the same side of the mainboard with the chips, or locate on the other sides of the main board, orpenetrate through the opening in the main board, or be buried into themain board, or adopt any combination of the above ways. Connecting modesbetween the input and the output of any separate module among theplurality of modules and the system, arrangement and implementationmodes of pins of the modules, implementation modes of heat dissipationand anti-interference of the modules may adopt one or more modesdescribed in the above embodiments.

The combined structures of the above embodiments may contain a socket,to facilitate the chip to perform connections of other signals with thecircuit board. However, in fact, by the structure that the powerconverting module and the CPU are stacked, the CPU may perform theconnections of other signals with the circuit board directly through thepower converting module. As shown in FIG. 11, in the assembledstructure, the two modules are located on two opposite sides of the mainboard respectively. The CPUs 22, 62 and 102 are provided on the secondmodule (module 2). The heat sinks 24, 64 and 104 are provided on theCPUs 22, 62 and 102 to dissipate heat from the CPUs, or the heat sinksmay be provided below the first module (module 1). The arrangement modeof pins of the second module (module 2) may adopt any one of the aboveembodiments. In one embodiment, the CPU may receive power source signalof the first module through pins of the second module, and provide somefeedback control signals to the first module. In above embodiments,signal exchange between the CPU and other chips on the main board may beperformed after the socket connects the circuit board, but the presentdisclosure is not limited thereto. In FIG. 11, the signal exchange maybe performed by traces on the surfaces of the second module or insidethe second module connecting the main boards 21, 61 and 101. The secondmodule may not only serve as a converting module to provide power sourcefor the CPU, but also serve as a connecting structure to electricallyconnect the CPU and the main board. The present disclosure is notlimited to this.

In one embodiment, the circuit board, the CPU and the power convertingmodule (such as a DC/DC converter) may form an assembly structure in astacking sequence. For example, the stacking sequence may be the CPU onthe DC/DC converter, then the DC/DC converter on the circuit board; orthe CPU on the circuit board, then the circuit board on the DC/DCconverter; or the CPU on the circuit board and the DC/DC converter beingat least partly buried in the circuit board. The present disclosure isnot limited to this.

FIGS. 12A-12G are schematic diagrams of several possible functions andmutual connection relationships between two modules. Two modules in FIG.12A constitute a two-stage power supply mode. An input voltage of themodule 1 is, for example, 400V, 48V or 12V, and an output voltage of themodule 2 is, for example, 12V or a range of 0.5V-5V. The presentdisclosure is not limited to this. Inputs and outputs of two modules inFIG. 12B are in parallel. Two power source modules in FIG. 12C are inthe connection relationship of input-series-output-parallel, that is,their inputs are in series and their outputs are in parallel. Input endsof two power source modules in FIG. 12D are in parallel, and theiroutputs supply power for different loads respectively. Input ends of twopower source modules in FIG. 12E are in series, and their outputs supplypower for different loads respectively. A second module (module 2) and afirst module (module 1) in FIG. 12F may communicate with each other. Afirst module in FIG. 12G may be a converting module, whose output is apower with a DC component and a high frequency AC (HFAC) component atthe same time. A second module in FIG. 12G may be a filter module, whichfilters the HFAC component output by the first module and transmits theDC power to the chip (CPU).

A numerical value of an input voltage or output voltage of the powersource module or a combination of the power source module may beunderstood not only as a fixed value, but also as a range containing agiven value. For example, an input voltage 400V may be understood notonly as the input voltage being 400V, but also as a range containing400V (for example, 200V-50V). Similarly, an input voltage 48V may beunderstood as a range of 18V-72V, and an input voltage 12V may beunderstood as a range of 5V-15V. The present disclosure is not limitedto this. An output voltage, for example, 0.5V-5V, may be understood asthat the output voltage is a steady voltage which may be adjusted asneeded. The present disclosure is not limited to this. A type of thepower source module or a combination of the power source module may havemany choices, for example, converting 400V to 48V, converting 400V to12V, converting 400V to 0.5-5V, converting 48V to 12V, converting 48V to0.5-5V, converting 12V to 0.5-5V and the like. The present disclosure isnot limited to this.

An electronic device according to one embodiment of the presentdisclosure, including: the assembly structure described above. Whereinthe electronic device is, for example, a server or a computer.

Exemplary implementations of the present disclosure have beenspecifically shown and described above. It should be understood that thepresent disclosure is not limited to the disclosed implementations.Instead, the present disclosure intends to cover various modificationsand equivalent replacements within the scope of the appended claims.

What is claimed is:
 1. An assembly structure for providing power for achip, comprising: a circuit board, configured to provide a firstelectrical energy; a chip; a power converting module, configured toelectrically connect the circuit board and the chip, convert the firstelectrical energy to a second electrical energy, and supply the secondelectrical energy to the chip, wherein the chip, the circuit board andthe power converting module are stacked; and a connection component,configured to electrically connect the circuit board and the powerconverting module; wherein the power converting module and the chip arelocated on two opposite sides of the circuit board; the connectioncomponent comprises a connector electrically connecting the circuitboard and the power converting module, wherein the connector and thechip are disposed on two opposite sides of the circuit board; and theconnection component further comprises a back plate, wherein the backplate and the chip are disposed on two opposite sides of the circuitboard.
 2. The assembly structure for providing power for a chipaccording to claim 1, wherein a connection point of the connector andthe circuit board is outside a projection of the chip on the circuitboard.
 3. The assembly structure for providing power for a chipaccording to claim 1, wherein the power converting module is partlyburied in the back plate, and a surface of the power converting moduleis exposed from the back plate and directly contacts the connector. 4.The assembly structure for providing power for a chip according to claim3, wherein the connector extends along an outer surface of the backplate, to electrically connect the circuit board and the powerconverting module.
 5. The assembly structure for providing power for achip according to claim 4, wherein the connector extends along a lateralsurface of the back plate and a surface of the back plate away from thecircuit board.
 6. The assembly structure for providing power for a chipaccording to claim 3, wherein a part of the connector is located betweenthe back plate and the circuit board, to electrically connect thecircuit board and the power converting module.
 7. The assembly structurefor providing power for a chip according to claim 1, wherein connectionpoints of the connector and the circuit board are on one side or moresides of a projection of the power converting module on the circuitboard.
 8. The assembly structure for providing power for a chipaccording to claim 1, wherein the connector is configured to transmitinput power of the power converting module from the circuit board to thepower converting module.
 9. The assembly structure for providing powerfor a chip according to claim 1, wherein the connector is configured totransmit output power of the power converting module from the powerconverting module to the circuit board.
 10. The assembly structure forproviding power for a chip according to claim 1, wherein the connectoris formed of heat conductive material.
 11. The assembly structure forproviding power for a chip according to claim 1, further comprising: aheat sink, disposed on the connector.
 12. An assembly structure forproviding power for a chip, comprising: a circuit board, configured toprovide a first electrical energy; a chip; a power converting module,configured to electrically connect the circuit board and the chip,convert the first electrical energy to a second electrical energy, andsupply the second electrical energy to the chip, wherein the chip, thecircuit board and the power converting module are stacked; and aconnection component, configured to electrically connect the circuitboard and the power converting module; wherein the power convertingmodule and the chip are located on two opposite sides of the circuitboard; the connection component comprises a connector electricallyconnecting the circuit board and the power converting module, whereinthe connector and the chip are disposed on two opposite sides of thecircuit board; and a surface of the connector is formed with a wingshaped structure.
 13. An assembly structure for providing power for achip, comprising: a circuit board, configured to provide a firstelectrical energy; a chip; a power converting module, configured toelectrically connect the circuit board and the chip, convert the firstelectrical energy to a second electrical energy, and supply the secondelectrical energy to the chip, wherein the chip, the circuit board andthe power converting module are stacked; and a connection component,configured to electrically connect the circuit board and the powerconverting module; wherein the power converting module and the chip arelocated on two opposite sides of the circuit board; and the connectioncomponent comprises: a back plate, electrically connecting the circuitboard and the power converting module, wherein the back plate and thechip are disposed on two opposite sides of the circuit board.